CBTD16213DL,512
vs
PI5C16213VX
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PERICOM SEMICONDUCTOR CORP
|
Part Package Code |
SSOP
|
SSOP
|
Package Description |
SSOP, SSOP56,.4
|
SSOP,
|
Pin Count |
56
|
56
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
JESD-609 Code |
e4
|
e0
|
Length |
18.425 mm
|
18.415 mm
|
Logic IC Type |
BUS EXCHANGER
|
BUS EXCHANGER
|
Number of Bits |
12
|
12
|
Number of Functions |
2
|
2
|
Number of Ports |
4
|
3
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Equivalence Code |
SSOP56,.4
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.8 mm
|
2.794 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
|
|
|
Compare CBTD16213DL,512 with alternatives
Compare PI5C16213VX with alternatives