CBTD16212DGG
vs
CBT16212DGG-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
TSSOP
Package Description
TSSOP, TSSOP56,.3,20
TSSOP,
Pin Count
56
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBT/FST/QS/5C/B
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
Length
14 mm
14 mm
Logic IC Type
BUS EXCHANGER
BUS EXCHANGER
Number of Bits
24
24
Number of Functions
1
1
Number of Ports
4
4
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP56,.3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Propagation Delay (tpd)
0.25 ns
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
6.1 mm
6.1 mm
Base Number Matches
2
2
Date Of Intro
2017-02-01
Compare CBTD16212DGG with alternatives
Compare CBT16212DGG-T with alternatives