CBT6800PW,118 vs 74FST6800PG feature comparison

CBT6800PW,118 NXP Semiconductors

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74FST6800PG Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP
Package Description TSSOP, SOP, TSSOP24,.25
Pin Count 24
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G24 R-PDSO-G24
Length 7.8 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Width 4.4 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP24,.25
Peak Reflow Temperature (Cel) 240
Technology CMOS
Terminal Finish Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s) 20

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Compare 74FST6800PG with alternatives