CBT3384DK
vs
CYBUS3384QC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
CYPRESS SEMICONDUCTOR CORP
Part Package Code
SSOP
SOIC
Package Description
3.90 MM, 0.635 MM PITCH, PLASTIC, MO-137, SOT556-1, QSOP-24
0.150 INCH, QSOP-24
Pin Count
24
24
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
JESD-609 Code
e4
e0
Length
8.7 mm
8.65 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Bits
5
5
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP24,.24
SSOP24,.24
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.73 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3.9 mm
Base Number Matches
3
2
Additional Feature
TTL COMPATIBLE BUS SWITCH
Load Capacitance (CL)
50 pF
Compare CBT3384DK with alternatives
Compare CYBUS3384QC with alternatives