CBT3257ABQ
vs
FST3257MX
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, VQFN-16
|
0.150 INCH, ROHS COMPLIANT, MS-012, SOIC-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
3257
|
CBT/FST/QS/5C/B
|
| JESD-30 Code |
R-PQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
3.5 mm
|
9.9 mm
|
| Logic IC Type |
MULTIPLEXER AND DEMUX/DECODER
|
MULTIPLEXER AND DEMUX/DECODER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
1
|
4
|
| Number of Outputs |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2.5 mm
|
3.9 mm
|
| Base Number Matches |
2
|
3
|
| Manufacturer Package Code |
|
16LD,SOIC,JEDEC MS-012,.150" ,NARROW BODY
|
| ECCN Code |
|
EAR99
|
| Package Equivalence Code |
|
SOP16,.25
|
| Technology |
|
CMOS
|
|
|
|
Compare CBT3257ABQ with alternatives
Compare FST3257MX with alternatives