CBT3126D,112 vs FST3126M feature comparison

CBT3126D,112 NXP Semiconductors

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FST3126M Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code SOIC SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 SOP,
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e3
Length 8.65 mm 8.65 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.75 mm 1.753 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 3
Pbfree Code Yes
Additional Feature BUS SWITCH
Technology CMOS

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