CBT3125PW,112
vs
SN74CBT3125PWRE4
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
|
TSSOP, TSSOP14,.25
|
Pin Count |
14
|
14
|
Manufacturer Package Code |
SOT402-1
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
e4
|
Length |
5 mm
|
5 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
1
|
4
|
Number of Functions |
4
|
4
|
Number of Ports |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Propagation Delay (tpd) |
0.25 ns
|
0.35 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Samacsys Manufacturer |
|
Texas Instruments
|
Control Type |
|
ENABLE LOW
|
Count Direction |
|
BIDIRECTIONAL
|
Load Capacitance (CL) |
|
50 pF
|
Package Equivalence Code |
|
TSSOP14,.25
|
Packing Method |
|
TR
|
Power Supply Current-Max (ICC) |
|
0.003 mA
|
Prop. Delay@Nom-Sup |
|
0.25 ns
|
Technology |
|
CMOS
|
|
|
|
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-
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-
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-
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