CBT3125DS
vs
FST3125QSC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ON SEMICONDUCTOR
Part Package Code
SOIC
Package Description
PLASTIC, SOT-519-1, SSOP-16
LSSOP, SSOP16,.25
Pin Count
16
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBT/FST/QS/5C/B
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
Length
4.9 mm
5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
4
1
Number of Functions
1
4
Number of Ports
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
LSSOP
Package Equivalence Code
SSOP16,.25
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Seated Height-Max
1.73 mm
1.65 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Width
3.9 mm
3.9 mm
Base Number Matches
3
3
Factory Lead Time
4 Weeks
Control Type
ENABLE LOW
Count Direction
UNIDIRECTIONAL
Load Capacitance (CL)
50 pF
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.003 mA
Prop. Delay@Nom-Sup
0.25 ns
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