CBT16211DGG,118
vs
IDT74FST163211PAG8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP, TSSOP56,.3,20
TSSOP, TSSOP56,.3,20
Pin Count
56
56
Manufacturer Package Code
SOT364-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBT/FST/QS/5C/B
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
JESD-609 Code
e4
e3
Length
14 mm
14 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
12
12
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP56,.3,20
TSSOP56,.3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
6.1 mm
6.1 mm
Base Number Matches
2
1
Additional Feature
TTL COMPATIBLE BUS SWITCH
Load Capacitance (CL)
50 pF
Compare CBT16211DGG,118 with alternatives
Compare IDT74FST163211PAG8 with alternatives