CBR1-D060S
vs
DF06S-E3
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
VISHAY SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
SMDIP-4
|
R-PDSO-G4
|
| Pin Count |
4
|
4
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Factory Lead Time |
10 Weeks
|
|
| Samacsys Manufacturer |
Central Semiconductor
|
Vishay
|
| Breakdown Voltage-Min |
600 V
|
600 V
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.1 V
|
1.1 V
|
| JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G4
|
| JESD-609 Code |
e0
|
e3
|
| Non-rep Pk Forward Current-Max |
50 A
|
50 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Current-Max |
10 µA
|
|
| Reverse Test Voltage |
600 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
CASE DFS
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Reference Standard |
|
UL RECOGNIZED
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare CBR1-D060S with alternatives
Compare DF06S-E3 with alternatives