CBAS17TR
vs
BAS17T/R
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
STABISTOR DIODE
|
STABISTOR DIODE
|
Forward Voltage-Max (VF) |
0.96 V
|
0.96 V
|
Forward Voltage-Min (VF) |
0.87 V
|
0.87 V
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e0
|
e3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Dissipation-Max |
0.35 W
|
0.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
4 V
|
4 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
3
|
Part Package Code |
|
SOT-23
|
Package Description |
|
PLASTIC PACKAGE-3
|
Pin Count |
|
3
|
JEDEC-95 Code |
|
TO-236AB
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare CBAS17TR with alternatives
Compare BAS17T/R with alternatives