CAT9555HT6I-G
vs
CAT9555HV6I-GT2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN, LCC24,.16SQ,20
|
HVQCCN,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
0.4 MHz
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N24
|
S-PQCC-N24
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4 mm
|
4 mm
|
| Number of Bits |
16
|
|
| Number of I/O Lines |
16
|
16
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC24,.16SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
4 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
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