C2012X7R474KGP vs CL21B474KBFGNNE feature comparison

C2012X7R474KGP Darfon Corporation

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CL21B474KBFGNNE Samsung Electro-Mechanics

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer DARFON ELECTRONICS CORP SAMSUNG ELECTRO-MECHANICS
Package Description CHIP , 0805
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20
Capacitance 0.47 µF 0.47 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.25 mm 1.25 mm
JESD-609 Code e3 e3
Length 2 mm 2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Style SMT SMT
Packing Method TR, EMBOSSED, 7 INCH TR, Plastic, 7 Inch
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 50 V 50 V
Size Code 0805 0805
Surface Mount YES YES
Temperature Characteristics Code X7R X7R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish MATTE TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Width 1.25 mm 1.25 mm
Base Number Matches 1 1

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