C2012X7R474KGP
vs
CL21B474KBFGNNE
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
DARFON ELECTRONICS CORP
SAMSUNG ELECTRO-MECHANICS
Package Description
CHIP
, 0805
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
Capacitance
0.47 µF
0.47 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.25 mm
1.25 mm
JESD-609 Code
e3
e3
Length
2 mm
2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Style
SMT
SMT
Packing Method
TR, EMBOSSED, 7 INCH
TR, Plastic, 7 Inch
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
50 V
50 V
Size Code
0805
0805
Surface Mount
YES
YES
Temperature Characteristics Code
X7R
X7R
Temperature Coefficient
15% ppm/°C
15% ppm/°C
Terminal Finish
MATTE TIN OVER NICKEL
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
1.25 mm
1.25 mm
Base Number Matches
1
1
Compare C2012X7R474KGP with alternatives
Compare CL21B474KBFGNNE with alternatives