C2012X5R1H475K125AB vs MSASU21GBB5475KTNA01 feature comparison

C2012X5R1H475K125AB TDK Corporation

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MSASU21GBB5475KTNA01 TAIYO YUDEN

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer TDK CORP TAIYO YUDEN CO LTD
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 25 Weeks, 3 Days
Capacitance 4.7 µF 4.7 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.25 mm 1.25 mm
JESD-609 Code e3
Length 2 mm 2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, 7 Inch TR, Embossed, 7 Inch
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 50 V 50 V
Size Code 0805 0805
Surface Mount YES YES
Temperature Characteristics Code X5R X5R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Width 1.25 mm 1.25 mm
Base Number Matches 2 1

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Compare MSASU21GBB5475KTNA01 with alternatives