C2012X5R1A475K
vs
MBASL21GAB5475KTNA18
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TDK CORP
|
TAIYO YUDEN CO LTD
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.24.00.20
|
8532.24.00.20
|
| Samacsys Manufacturer |
TDK
|
|
| Capacitance |
4.7 µF
|
4.7 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
1.25 mm
|
1.25 mm
|
| JESD-609 Code |
e3
|
|
| Length |
2 mm
|
2 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
10 V
|
10 V
|
| Size Code |
0805
|
0805
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
X5R
|
X5R
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
2
|
1
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Packing Method |
|
TR, EMBOSSED, 7 INCH
|
|
|
|
Compare C2012X5R1A475K with alternatives
Compare MBASL21GAB5475KTNA18 with alternatives