BZX79C4V3.TR
vs
BZX79-C4V3,113
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
O-LALF-W2
HERMETIC SEALED, GLASS, SC-40, 2 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
Knee Impedance-Max
600 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
4.3 V
4.3 V
Reverse Current-Max
5 µA
3 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
1 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
3
2
Rohs Code
Part Package Code
AXIAL
Pin Count
2
Manufacturer Package Code
SOD27
Factory Lead Time
4 Weeks
Dynamic Impedance-Max
90 Ω
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
260
Reference Standard
CECC50005-005
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
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