BZX79-C43,113
vs
BZX79-C43,133
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
AXIAL
AXIAL
Package Description
HERMETIC SEALED, GLASS, SC-40, 2 PIN
HERMETIC SEALED, GLASS, SC-40, 2 PIN
Pin Count
2
2
Manufacturer Package Code
SOD27
SOD27
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
4 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
150 Ω
150 Ω
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
CECC50005-005
Reference Voltage-Nom
43 V
43 V
Reverse Current-Max
0.05 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
30
Voltage Temp Coeff-Max
46.6 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
2 mA
2 mA
Base Number Matches
2
2
Compare BZX79-C43,113 with alternatives
Compare BZX79-C43,133 with alternatives