BZX79-C33116 vs BZX79C33-TP feature comparison

BZX79-C33116 NXP Semiconductors

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BZX79C33-TP Micro Commercial Components

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Reverse Current-Max 0.05 µA 0.00005 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 33.4 mV/°C
Voltage Tol-Max 5% 6.06%
Working Test Current 2 mA 2 mA
Base Number Matches 1 1
Part Package Code DO-35
Package Description O-LALF-W2
Pin Count 2
Additional Feature METALLURGICAL BONDED
Dynamic Impedance-Max 80 Ω
Forward Voltage-Max (VF) 0.9 V
Knee Impedance-Max 325 Ω
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Reverse Test Voltage 24 V
Time@Peak Reflow Temperature-Max (s) 10

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Compare BZX79C33-TP with alternatives