BZX79-C30,133 vs TCBZX79C30 feature comparison

BZX79-C30,133 NXP Semiconductors

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TCBZX79C30 Tak Cheong Electronics (Holdings) Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Part Package Code AXIAL DO-35
Package Description HERMETIC SEALED, GLASS, SC-40, 2 PIN O-LALF-W2
Pin Count 2 2
Manufacturer Package Code SOD27
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Factory Lead Time 4 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 80 Ω 80 Ω
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260 250
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard CECC50005-005
Reference Voltage-Nom 30 V 30 V
Reverse Current-Max 0.05 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max 29.4 mV/°C
Voltage Tol-Max 5% 6.67%
Working Test Current 2 mA 2 mA
Base Number Matches 1 9
Pbfree Code Yes

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