BZX79-C13,133
vs
BZX79-C13153
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
AXIAL
Package Description
HERMETIC SEALED, GLASS, SC-40, 2 PIN
O-LALF-W2
Pin Count
2
Manufacturer Package Code
SOD27
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
CECC50005-005
Reference Voltage-Nom
13 V
13 V
Reverse Current-Max
0.1 µA
0.1 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
11 mV/°C
11 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
2
1
Pbfree Code
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