BZX55C8V2
vs
BZX55C8V2RL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TAIWAN SEMICONDUCTOR CO LTD
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
Taiwan Semiconductor
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
8.2 V
8.2 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Matte Tin (Sn)
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
6.1%
6.1%
Working Test Current
5 mA
5 mA
Base Number Matches
7
3
Pbfree Code
Part Package Code
DO-204
Pin Count
2
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
7 Ω
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
250
Compare BZX55C8V2 with alternatives
Compare BZX55C8V2RL with alternatives