BZX55C47
vs
BZX55C47RL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
MOTOROLA INC
Part Package Code
DO-35
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN
O-LALF-W2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
110 Ω
110 Ω
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
250
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
47 V
47 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
6.38%
5%
Working Test Current
2.5 mA
2.5 mA
Base Number Matches
17
2
Operating Temperature-Min
-65 °C
Reverse Current-Max
0.1 µA
Compare BZX55C47 with alternatives
Compare BZX55C47RL with alternatives