BZX55C36
vs
BZX55C36
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
FORMOSA MICROSEMI CO LTD
Part Package Code
DO-35
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
80 Ω
80 Ω
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
JESD-609 Code
e3
Number of Elements
1
1
Number of Terminals
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Peak Reflow Temperature (Cel)
250
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
36 V
36 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
Terminal Form
WIRE
Terminal Position
AXIAL
Voltage Tol-Max
5.56%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
17
1
Compare BZX55C36 with alternatives
Compare BZX55C36 with alternatives