BZX384C12-GS08
vs
PZU12B,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
25 Ω
|
80 Ω
|
| JESD-609 Code |
e3
|
e3
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.2 W
|
0.31 W
|
| Reference Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SOD
|
| Package Description |
|
PLASTIC, SC-90, 2 PIN
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
SOD323F
|
| Diode Element Material |
|
SILICON
|
| JESD-30 Code |
|
R-PDSO-F2
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
IEC-60134
|
| Technology |
|
ZENER
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BZX384C12-GS08 with alternatives
Compare PZU12B,115 with alternatives