BZX384-C2V4,115
vs
JAN1N4370AUR-1
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOD
|
|
| Package Description |
PLASTIC, SMD, SC-76, 2 PIN
|
MELF-2
|
| Pin Count |
2
|
|
| Manufacturer Package Code |
SOD323
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
600 Ω
|
30 Ω
|
| JESD-30 Code |
R-PDSO-G2
|
O-LELF-R2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.3 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Voltage-Nom |
2.4 V
|
2.4 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
5 mA
|
20 mA
|
| Base Number Matches |
2
|
8
|
| Factory Lead Time |
|
20 Weeks
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
ISOLATED
|
| JEDEC-95 Code |
|
DO-213AA
|
| Reference Standard |
|
MIL-19500
|
| Reverse Current-Max |
|
100 µA
|
| Reverse Test Voltage |
|
1 V
|
| Voltage Temp Coeff-Max |
|
-2.04 mV/°C
|
|
|
|
Compare BZX384-C2V4,115 with alternatives
Compare JAN1N4370AUR-1 with alternatives