BZX284-C33135
vs
BZM55C33
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICRO COMMERCIAL COMPONENTS
|
| Package Description |
R-CDSO-C2
|
O-LELF-R2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
R-CDSO-C2
|
O-LELF-R2
|
| JESD-609 Code |
e3
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.4 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
33 V
|
33 V
|
| Reverse Current-Max |
0.05 µA
|
0.0001 µA
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
C BEND
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
END
|
| Voltage Temp Coeff-Max |
29.7 mV/°C
|
|
| Voltage Tol-Max |
5%
|
6.06%
|
| Working Test Current |
2 mA
|
5 mA
|
| Base Number Matches |
1
|
6
|
| Rohs Code |
|
No
|
| Part Package Code |
|
MELF
|
| Case Connection |
|
ISOLATED
|
| Dynamic Impedance-Max |
|
80 Ω
|
| Knee Impedance-Max |
|
220 Ω
|
|
|
|
Compare BZX284-C33135 with alternatives
Compare BZM55C33 with alternatives