BZV85-C4V7,133
vs
MQ1N4732AGTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROSEMI CORP
Part Package Code
DO-4
DO-204
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Pin Count
2
2
Manufacturer Package Code
SOD66
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
13 Ω
JEDEC-95 Code
DO-41
DO-204AL
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Reference Voltage-Nom
4.7 V
4.7 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
5%
5%
Working Test Current
45 mA
53 mA
Base Number Matches
2
1
Pbfree Code
Operating Temperature-Min
-65 °C
Qualification Status
Not Qualified
Compare BZV85-C4V7,133 with alternatives
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