BZV85-C15,113
vs
BZV85-C15
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROSEMI CORP
Part Package Code
DO-4
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Manufacturer Package Code
SOD66
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Additional Feature
CAPACITANCE IS CAPTURED FROM THE GRAPH
PRO-ELECTRON SPECIFICATION
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
JEDEC-95 Code
DO-41
DO-213AB
JESD-30 Code
O-LALF-W2
O-LELF-R2
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1.3 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
CECC50005-010
Reference Voltage-Nom
15 V
15 V
Reverse Current-Max
0.05 µA
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN LEAD
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
13.6 mV/°C
Voltage Tol-Max
5%
6%
Working Test Current
15 mA
15 mA
Base Number Matches
1
1
Pbfree Code
Compare BZV85-C15,113 with alternatives
Compare BZV85-C15 with alternatives