BZV80TRL13
vs
RH821
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROSEMI CORP
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Voltage Temp Coeff-Max
0.62 mV/°C
0.62 mV/°C
Working Test Current
7.5 mA
7.5 mA
Base Number Matches
2
1
Rohs Code
Part Package Code
DO-7
Pin Count
2
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
15 Ω
JEDEC-95 Code
DO-204AA
JESD-609 Code
e0
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Power Dissipation-Max
0.5 W
Terminal Finish
TIN LEAD
Voltage Tol-Max
4.84%
Compare BZV80TRL13 with alternatives
Compare RH821 with alternatives