BZV55F51 vs MQ1N5262BTR feature comparison

BZV55F51 NXP Semiconductors

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MQ1N5262BTR Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Package Description O-LELF-R2 O-LALF-W2
Reach Compliance Code unknown unknown
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 51 V 51 V
Reverse Current-Max 0.05 µA
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Temp Coeff-Max 57.2 mV/°C
Voltage Tol-Max 3% 5%
Working Test Current 2 mA 20 mA
Base Number Matches 4 1
Rohs Code No
Part Package Code DO-7
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
JEDEC-95 Code DO-204AA
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD

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