BZV55F3V0 vs MSP1N5227BTR feature comparison

BZV55F3V0 YAGEO Corporation

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MSP1N5227BTR Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS MICROSEMI CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3 V 3.6 V
Reverse Current-Max 10 µA
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Temp Coeff-Max
Voltage Tol-Max 3% 5%
Working Test Current 5 mA 20 mA
Base Number Matches 3 2
Rohs Code No
Part Package Code DO-7
Package Description HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count 2
JEDEC-95 Code DO-204AA
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD

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