BZV55C8V2TRL vs BZV55C8V2-TP feature comparison

BZV55C8V2TRL YAGEO Corporation

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BZV55C8V2-TP Micro Commercial Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS MICRO COMMERCIAL COMPONENTS
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 8.2 V 8.2 V
Reverse Current-Max 0.7 µA 0.0001 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max 6.2 mV/°C
Voltage Tol-Max 5%
Working Test Current 5 mA 5 mA
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code MELF
Pin Count 2
Samacsys Manufacturer MCC
Additional Feature HIGH RELIABILITY
Dynamic Impedance-Max 7 Ω
JESD-609 Code e3
Knee Impedance-Max 50 Ω
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 10

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