BZV55C6V2TRL13
vs
BZV55C6V2-TP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICRO COMMERCIAL COMPONENTS
Package Description
O-LELF-R2
O-LELF-R2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.2 V
6.2 V
Reverse Current-Max
3 µA
0.0001 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
Matte Tin (Sn)
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
3.7 mV/°C
Voltage Tol-Max
5%
Working Test Current
5 mA
5 mA
Base Number Matches
2
1
Part Package Code
MELF
Pin Count
2
Samacsys Manufacturer
MCC
Additional Feature
HIGH RELIABILITY
Dynamic Impedance-Max
10 Ω
Knee Impedance-Max
200 Ω
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Operating Temperature-Min
-55 °C
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
10
Compare BZV55C6V2TRL13 with alternatives
Compare BZV55C6V2-TP with alternatives