BZV55C5V1 vs BZV55C5V1P feature comparison

BZV55C5V1 NXP Semiconductors

Buy Now Datasheet

BZV55C5V1P Micro Commercial Components

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS
Package Description O-LELF-R2 MINIMELF-2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
Dynamic Impedance-Max 60 Ω
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.4 W
Qualification Status Not Qualified
Reference Voltage-Nom 5.1 V
Reverse Current-Max 2 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max
Voltage Tol-Max 5%
Working Test Current 5 mA
Base Number Matches 13 1
Part Package Code MELF

Compare BZV55C5V1 with alternatives

Compare BZV55C5V1P with alternatives