BZV55C56TRL13 vs BZV55C56 feature comparison

BZV55C56TRL13 NXP Semiconductors

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BZV55C56 Microchip Technology Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Package Description O-LELF-R2 HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 56 V 56 V
Reverse Current-Max 0.05 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max 63.8 mV/°C
Voltage Tol-Max 5% 7.14%
Working Test Current 2 mA 2 mA
Base Number Matches 1 2
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED
JEDEC-95 Code DO-213AA

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