BZV55C56T4 vs TCBZV55C56 feature comparison

BZV55C56T4 Motorola Mobility LLC

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TCBZV55C56 Tak Cheong Electronics (Holdings) Co Ltd

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Part Package Code DO-34 DO-213AC
Package Description O-LELF-N2 O-LELF-R2
Pin Count 2 2
Manufacturer Package Code CASE 362-03
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-N2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 56 V 56 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form NO LEAD WRAP AROUND
Terminal Position END END
Voltage Tol-Max 7.14% 7.14%
Working Test Current 2 mA 2.5 mA
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Dynamic Impedance-Max 135 Ω
JEDEC-95 Code DO-213AC
JESD-609 Code e3
Operating Temperature-Max 175 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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