BZV55C3V6TRL13
vs
BZV55C3V6
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROCHIP TECHNOLOGY INC
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Reverse Current-Max
5 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
Voltage Tol-Max
5%
5.56%
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
Factory Lead Time
14 Weeks
Samacsys Manufacturer
Microchip
Additional Feature
METALLURGICALLY BONDED
JEDEC-95 Code
DO-213AA
Compare BZV55C3V6TRL13 with alternatives
Compare BZV55C3V6 with alternatives