BZV55C3V6TRL vs BZV55C3V6 feature comparison

BZV55C3V6TRL YAGEO Corporation

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BZV55C3V6 Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS MOTOROLA INC
Package Description O-LELF-R2 HERMETIC SEALED, GLASS, CASE 362-03, LEADLESS DO-34, 2 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-N2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.6 V 3.6 V
Reverse Current-Max 5 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND NO LEAD
Terminal Position END END
Voltage Temp Coeff-Max
Voltage Tol-Max 5% 5.56%
Working Test Current 5 mA 5 mA
Base Number Matches 2 5
Rohs Code No
Dynamic Impedance-Max 90 Ω
JESD-609 Code e0
Operating Temperature-Max 200 °C
Terminal Finish TIN LEAD

Compare BZV55C3V6TRL with alternatives

Compare BZV55C3V6 with alternatives