BZV55C3V6TRL vs BZV55C3V6 feature comparison

BZV55C3V6TRL YAGEO Corporation

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BZV55C3V6 Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer PHILIPS COMPONENTS MICROSEMI CORP
Package Description O-LELF-R2 HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.6 V 3.6 V
Reverse Current-Max 5 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max
Voltage Tol-Max 5% 5.56%
Working Test Current 5 mA 5 mA
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Part Package Code DO-213AA
Pin Count 2
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED
JEDEC-95 Code DO-213AA
JESD-609 Code e0
Terminal Finish TIN LEAD

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