BZV55C3V3TR
vs
BZV55C3V3
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
95 Ω
|
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Voltage Tol-Max |
5%
|
6.06%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
3
|
1
|
Package Description |
|
HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
|
Factory Lead Time |
|
14 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Additional Feature |
|
METALLURGICALLY BONDED
|
JEDEC-95 Code |
|
DO-213AA
|
|
|
|
Compare BZV55C3V3TR with alternatives
Compare BZV55C3V3 with alternatives