BZV55C39-T1 vs BZV55C39TRL feature comparison

BZV55C39-T1 Sangdest Microelectronics (Nanjing) Co Ltd

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BZV55C39TRL NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SANGDEST MICROELECTRONICS (NANJING) CO LTD NXP SEMICONDUCTORS
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code unknown unknown
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 39 V 39 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5.13% 5%
Working Test Current 2.5 mA 2 mA
Base Number Matches 2 2
Pbfree Code Yes
ECCN Code EAR99
HTS Code 8541.10.00.50
JESD-609 Code e3
Reverse Current-Max 0.05 µA
Terminal Finish TIN
Voltage Temp Coeff-Max 41.2 mV/°C

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