BZV55C39 vs LL973B feature comparison

BZV55C39 Motorola Mobility LLC

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LL973B Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MICROSEMI CORP
Part Package Code DO-34
Package Description O-LELF-N2
Pin Count 2
Manufacturer Package Code CASE 362-03
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 130 Ω 58 Ω
JESD-30 Code O-LELF-N2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 200 °C 200 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 39 V 33 V
Surface Mount YES YES
Technology ZENER
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Position END
Voltage Tol-Max 5.13% 5%
Working Test Current 2 mA 3.8 mA
Base Number Matches 5 14

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