BZV55C39
vs
BZV55C39
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
LITE-ON SEMICONDUCTOR CORP
STMICROELECTRONICS
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, LL-34, MINIMELF-2
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
39 V
39 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5.13%
5%
Working Test Current
2.5 mA
2.5 mA
Base Number Matches
1
1
Dynamic Impedance-Max
130 Ω
JESD-609 Code
e0
Knee Impedance-Max
500 Ω
Operating Temperature-Min
-55 °C
Qualification Status
Not Qualified
Reverse Current-Max
0.1 µA
Terminal Finish
TIN LEAD
Voltage Temp Coeff-Max
46.8 mV/°C
Compare BZV55C39 with alternatives
Compare BZV55C39 with alternatives