BZV55C36T3
vs
SZN6325DS
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
SOLID STATE DEVICES INC
|
| Part Package Code |
DO-34
|
|
| Package Description |
O-LELF-N2
|
O-LALF-W2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
CASE 362-03
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-LELF-N2
|
O-LALF-W2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
36 V
|
11 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Voltage Tol-Max |
5.56%
|
1%
|
| Working Test Current |
2 mA
|
20 mA
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare BZV55C36T3 with alternatives
Compare SZN6325DS with alternatives