BZV55C33TR vs BZV55C33-T1 feature comparison

BZV55C33TR Central Semiconductor Corp

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BZV55C33-T1 Sangdest Microelectronics (Nanjing) Co Ltd

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer CENTRAL SEMICONDUCTOR CORP SANGDEST MICROELECTRONICS (NANJING) CO LTD
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 80 Ω
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5% 6.06%
Working Test Current 2 mA 5 mA
Base Number Matches 1 2
Package Description O-LELF-R2
Moisture Sensitivity Level 1

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