BZV55C24-TP vs BZV55C24TRL13 feature comparison

BZV55C24-TP Micro Commercial Components

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BZV55C24TRL13 NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS NXP SEMICONDUCTORS
Part Package Code MELF
Package Description O-LELF-R2 O-LELF-R2
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Samacsys Manufacturer MCC
Additional Feature HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 80 Ω
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3 e3
Knee Impedance-Max 220 Ω
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 24 V 24 V
Reverse Current-Max 0.0001 µA 0.05 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish Matte Tin (Sn) TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 10
Working Test Current 5 mA 5 mA
Base Number Matches 1 2
Voltage Temp Coeff-Max 22 mV/°C
Voltage Tol-Max 5%

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Compare BZV55C24TRL13 with alternatives