BZV55C24-TP
vs
BZV55C24TRL13
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS
NXP SEMICONDUCTORS
Part Package Code
MELF
Package Description
O-LELF-R2
O-LELF-R2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
MCC
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
80 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Knee Impedance-Max
220 Ω
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
Operating Temperature-Min
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
24 V
24 V
Reverse Current-Max
0.0001 µA
0.05 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Matte Tin (Sn)
TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
10
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
Voltage Temp Coeff-Max
22 mV/°C
Voltage Tol-Max
5%
Compare BZV55C24-TP with alternatives
Compare BZV55C24TRL13 with alternatives