BZV55C24-T1
vs
BZV55-C24,135
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SANGDEST MICROELECTRONICS (NANJING) CO LTD
NXP SEMICONDUCTORS
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
unknown
compliant
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
24.2 V
24.2 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5.79%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
2
2
Part Package Code
MELF
Pin Count
2
Manufacturer Package Code
SOD80C
ECCN Code
EAR99
HTS Code
8541.10.00.50
Factory Lead Time
4 Weeks
Dynamic Impedance-Max
70 Ω
JESD-609 Code
e3
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
260
Reverse Current-Max
0.05 µA
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
22 mV/°C
Compare BZV55C24-T1 with alternatives
Compare BZV55-C24,135 with alternatives