BZV55C24-GT1 vs BZV55-C24112 feature comparison

BZV55C24-GT1 Sangdest Microelectronics (Nanjing) Co Ltd

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BZV55-C24112 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SANGDEST MICROELECTRONICS (NANJING) CO LTD NXP SEMICONDUCTORS
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code unknown unknown
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JESD-30 Code O-LELF-R2
Number of Elements 1
Number of Terminals 2
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 24.2 V
Surface Mount YES
Technology ZENER
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5.79%
Working Test Current 5 mA
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8541.10.00.50

Compare BZV55C24-GT1 with alternatives

Compare BZV55-C24112 with alternatives