BZV55C22TRL vs BZV55C22T1 feature comparison

BZV55C22TRL NXP Semiconductors

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BZV55C22T1 Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description O-LELF-R2 O-LELF-N2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Number of Elements 1
Number of Terminals 2
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 22 V
Reverse Current-Max 0.05 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND
Terminal Position END
Voltage Temp Coeff-Max 20 mV/°C
Voltage Tol-Max 5%
Working Test Current 5 mA
Base Number Matches 2 2
Part Package Code DO-34
Pin Count 2
Manufacturer Package Code CASE 362-03

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