BZV55C22T4
vs
BZV55C22-G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
SANGDEST MICROELECTRONICS (NANJING) CO LTD
Part Package Code
DO-34
Package Description
O-LELF-N2
O-LELF-R2
Pin Count
2
Manufacturer Package Code
CASE 362-03
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Base Number Matches
2
2
Rohs Code
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
JESD-30 Code
O-LELF-R2
Number of Elements
1
Number of Terminals
2
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
22 V
Surface Mount
YES
Technology
ZENER
Terminal Form
WRAP AROUND
Terminal Position
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5.67%
Working Test Current
5 mA
Compare BZV55C22T4 with alternatives
Compare BZV55C22-G with alternatives